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traditional thin-film devices include exceptional structural quality, high surface-to-volume ratio, bottom-up device engineering with high-density on-chip integration, and utilization of quantum size effects
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RAP opportunity at National Institute of Standards and Technology NIST Enabling Advanced Functionalities in Photonics using Low-Dimensional Semiconductors Location Material Measurement
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RAP opportunity at National Institute of Standards and Technology NIST Augmented Intelligence for Semiconductor Manufacturing Location Engineering Laboratory, Intelligent Systems Division
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RAP opportunity at National Institute of Standards and Technology NIST Microwave Materials for High-Speed Microelectronics Location Communications Technology Laboratory, Radio Frequency
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RAP opportunity at National Institute of Standards and Technology NIST Microfluidics and Lab-on-a-Chip Technologies for Controlled Molecular Self-Assembly, Analytical Biochemistry, and
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RAP opportunity at National Institute of Standards and Technology NIST Fatigue and Fracture of Metallic Materials Processed via Additive Manufacturing Location Material Measurement Laboratory
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RAP opportunity at National Institute of Standards and Technology NIST Channel Sounding and Radio Frequency Propagation Location Communications Technology Laboratory, Radio Frequency Technology
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RAP opportunity at National Institute of Standards and Technology NIST Microbial “Dark Matter” Location Material Measurement Laboratory, Biosystems and Biomaterials Division opportunity location
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RAP opportunity at National Institute of Standards and Technology NIST Metrology for Semiconductor Manufacturing Location Physical Measurement Laboratory, Sensor Science Division opportunity
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RAP opportunity at National Institute of Standards and Technology NIST Mechanical Behavior of Organ-on-Chip Location Material Measurement Laboratory, Materials Science and Engineering Division