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traditional thin-film devices include exceptional structural quality, high surface-to-volume ratio, bottom-up device engineering with high-density on-chip integration, and utilization of quantum size effects
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Microscopic and Spectroscopic Characterization in Engineered Polymeric Materials NIST only participates in the February and August reviews. The purpose of this research is to develop advanced
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of structural responses for performance-based seismic engineering of tall buildings. Opportunities include the following: (1) developing improved modeling and analytical capabilities for nonlinear dynamic
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RAP opportunity at National Institute of Standards and Technology NIST Coupling electronic structure methods, artificial intelligence, and data-driven approaches for next-generation quantum
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RAP opportunity at National Institute of Standards and Technology NIST Methods and Applications in Ab Initio Thermochemistry Location Material Measurement Laboratory, Chemical Sciences Division
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corrected for, the noise and drift can directly affect not only the initial calibration of qubits, but also the coherence times and, ultimately, fidelities of the quantum control and readout operations
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RAP opportunity at National Institute of Standards and Technology NIST Enabling Advanced Functionalities in Photonics using Low-Dimensional Semiconductors Location Material Measurement
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RAP opportunity at National Institute of Standards and Technology NIST High-Performance Cryogenics Location Physical Measurement Laboratory, Quantum Electromagnetics Division opportunity
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RAP opportunity at National Institute of Standards and Technology NIST Machine Learning for Autonomous Genetic Engineering of Microbial Systems Location Material Measurement Laboratory
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RAP opportunity at National Institute of Standards and Technology NIST Advanced Instrumentation for Fundamental Electrical Measurements Location Physical Measurement Laboratory, Quantum