2 phd-in-packaging-technology Postdoctoral positions at Technical University of Denmark
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on efficiency, power density, and circuit dynamic response. The research will concentrate on creating novel circuit topologies, optimizing electronic components and revolutionizing their integration and packaging
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this technology and driving high-impact research outcomes. This postdoctoral position is funded by the European Innovation Council under the Pathfinder project Digital OpticaL cOmputing platfoRm for nEural networkS
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