26 quantum-engineering-"https:"-"https:" Postdoctoral positions at Stony Brook University
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Computer Engineering or a closely related field, completed by the start date of the appointment. U.S. citizenship is required. Research experience in at least one of the following areas: ● Chip design
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the appointment. Preferred Qualification: PhD degree in theoretical high energy nuclear and particle physics. A strong background in quantum field theory and experience in effective field theory/lattice gauge
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the appointment. Preferred Qualification: PhD degree in theoretical high energy nuclear and particle physics. A strong background in quantum field theory and experience in effective field theory/lattice gauge
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Postdoctoral Associate Required Qualifications (as evidenced by an attached resume): ● Doctoral degree (or foreign equivalent) in Mechanical Engineering, Physics, or a closely related field in
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Postdoctoral Associate Required Qualification: (as evidenced by an attached resume) Ph.D.(or foreign equivalent) in Mechanical Engineering, Electrical Engineering, Computer Science, Robotics, or a
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Postdoctoral Associate in Neuroimaging Required Qualifications: (as evidenced by an attached resume) ● Recent Ph.D. degree (or foreign equivalent) in Biomedical Engineering, Medical Physics
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Job Description Required Qualifications: (as evidenced by an attached resume) * Recent Ph.D. degree (or foreign equivalent) in Biomedical Engineering, Medical Physics, Electrical and Computer
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Computer Engineering or a closely related field, completed by the start date of the appointment. U.S. citizenship is required. Research experience in at least one of the following areas: ● Chip design
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Postdoctoral Associate in Neuroimaging Required Qualifications: (as evidenced by an attached resume) ● Recent Ph.D. degree (or foreign equivalent) in Biomedical Engineering, Medical Physics
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Computer Engineering or a closely related field, completed by the start date of the appointment. U.S. citizenship is required. Research experience in at least one of the following areas: ● Chip design