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(ILL). The current ML models are optimized mainly for (monochromatic) X-ray reflectometry. We aim to generalize this approach to a wide range of samples and time-of-flight NR, coupled with automatic data
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methodology toward 3D spatial and temporal strain–temperature imaging for the optimization of next-generation electronic and optoelectronic devices. Further information may be obtained from: Tobias Schülli (tel
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