Sort by
Refine Your Search
-
Listed
-
Country
-
Employer
-
Field
-
functions to work properly. Please turn on JavaScript in your browser and try again. UiO/Anders Lien 1st March 2026 Languages English English English PhD Research Fellow in Neuromorphic Microelectronics Apply
-
UiO/Anders Lien 1st March 2026 Languages English English English PhD Research Fellow in Neuromorphic Microelectronics Apply for this job See advertisement About the position Position as PhD Research
-
-research-fellow-in-neuromorphic-microelectronics Where to apply Website https://www.jobbnorge.no/en/available-jobs/job/294530/phd-research-fellow-in-ne… Requirements Research FieldComputer scienceEducation
-
substrates, and microelectronics. Familiarity with sensor integration and characterization methods, including for health monitoring/ wearable robotics applications. Ability to work independently and as part of
-
substrates, and microelectronics. Familiarity with sensor integration and characterization methods, including for health monitoring/ wearable robotics applications. Ability to work independently and as part of
-
substrates, and microelectronics. Familiarity with sensor integration and characterization methods, including for health monitoring/ wearable robotics applications. Ability to work independently and as part of
-
/ Microelectronics/ EEE/ or related. Hands-on semiconductor process development in cleanroom (Cu interconnect/wafer or hybrid bonding; litho/etch/CMP/plasma/anneal). Characterization: optical/profilometry, SEM/TEM
-
Recognition: Gain visibility with senior intelligence leaders while advancing your field. 2026/2027 Focus Areas: Artificial Intelligence, Biotechnology, Energy and Power, Microelectronics, and Quantum
-
/Contracting institution and scientific supervision: The workplan will be carried out in the Multimaterial 3D Printing Laboratory of CMEMS-Center for Electromechanical Microsystems of the University of Minho
-
. Chamoin, and E. Aldea, “Physics-informed Markov chains for remaining useful life prediction of wire bonds in power electronic modules,” Microelectronics Reliability, vol. 167, no. February, p. 115644, 2025