22 cloud-computing "https:" "St" Fellowship positions at Hong Kong Polytechnic University
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the research project - “Large language models for computational social science and FinTech applications”. He/She will be required to: (a) study and investigate the fundamental problem for identifying
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the research project - “Large-scale complex 3D geometric feature computation for domestic large aircraft”. They will be required to: (a) conduct advanced research on point cloud techniques for geometric
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Department of Computing Postdoctoral Fellow / Research Assistant (Ref. 260304011) (1) Postdoctoral Fellow (one to two posts) [Appointment period: each for twelve to twenty-four months] (2
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the research project - “Advancing generative AI algorithms for haptic rendering: bridging human-computer and human-robot interactions”. Qualifications Applicants should have a doctoral degree or an equivalent
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projects on-time with minimum supervision. Preference will be given to those with research experience in machines design and development of computer programmes for numerical computation of electromagnetic
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recognition, or computer vision; (b) a good understanding of the fundamentals of robot control, cobots, or UAV path planning; relevant coursework or project experience is preferred; (c) strong hands
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project - “Utilizing ChatGPT for personalised writing program to enhance writing growth mindset and motivation of undergraduate students”. He/She will be required to: (a) assist in conducting literature
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and energy materials. Preference will be given to those with knowledge of computer programming, AI and/or machining learning. Applicants are invited to contact Prof. Jianguo Lin at telephone number 2766
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for the Senior Research Fellow post should have a PhD degree in Computer Science, Artificial Intelligence, Data Science, Digital Economy or a related field plus at least six years of postdoctoral research
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Applicants should have a doctoral degree or an equivalent qualification in Biomedical Science, Bioengineering, Biomedical Engineering, Electronic Engineering, Computing, Materials Science, or related areas and