171 linked-data-"https:"-"https:"-"https:" research jobs at Hong Kong Polytechnic University
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based on laboratory data; (e) assist in preparing the publication in top-tier journals and present findings at international conferences; and (f) contribute to prepare research grant applications
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. Applicants are invited to contact Dr David D. W. Lui via email at david.lyu@polyu.edu.hk for further information. Conditions of Service A highly competitive remuneration package will be offered. The closing
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) assist in data collection using ArcGIS Survey123, including training SDU residents on questionnaire usage and tagging points of interest (POIs); (b) conduct spatial analysis and visualisation using
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to contact Miss Deng Jing via email at haungxaio.deng@polyu.edu.hk for further information. Conditions of Service A highly competitive remuneration package will be offered. The closing date for application is
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honours degree or an equivalent qualification. Applicants are invited to contact Ir Prof. Pai Zheng at telephone number 2766 5633 or via email at pai.zheng@polyu.edu.hk for further information. Conditions
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) solid mathematical background. Applicants are invited to contact Prof. Jinzhi Bu at telephone number 2766 7415 or via email at jinzhi.bu@polyu.edu.hk for further information. Conditions of Service A
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james.chungwai.cheung@polyu.edu.hk for further information. Conditions of Service A highly competitive remuneration package will be offered. The closing date for application is 11 August 2026. Apply Now Posting date: 12
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the challenge in Computational Social Science and FinTech; (b) perform data collection and processing for the identified challenge issues; (c) conduct data analysis and design a framework for the identified
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experience at the time of application. Applicants are invited to contact Prof. Qing Li at telephone number 2766 7252 or via email at qing-prof.li@polyu.edu.hk for further information. Conditions of Service A
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kam.kh.ng@polyu.edu.hk for further information. Conditions of Service A highly competitive remuneration package will be offered. The closing date for application is 23 February 2026. Apply Now Posting date