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for predicting the reliability of high-temperature structural components. This involves working with various continuum damage mechanics models and statistical reliability models. The goal is to enhance engineering
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and Environmental Engineering at the University of New Hampshire. The successful candidate will be responsible for developing and coding workflow processes and designing experiments for multisensory data
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on advanced internal combustion engines, with an emphasis on turbulent-jet ignition systems and structural-mechanics modeling of cylinder-kit components. The ideal candidate will possess a strong background in
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engineering, analytical chemistry, and computational methods for analyzing sequence information and molecular structures is required to perform research tasks A background in food science or food technology is
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, structured data for studying norm evolution in real time. Comparative work across disciplines will complement these analyses. This postdoc will have the opportunity to work at the intersection of Science
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Argonne National Laboratory’s Accelerator Science Division is seeking a Postdoctoral Appointee to contribute to the development of a Sub- THz Collinear Structural Wakefield Accelerator
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Posted on Tue, 12/16/2025 - 13:32 Important Info Faculty Sponsor First name: Barbara Faculty Sponsor Last Name: Simpson Stanford Departments and Centers: Civil and Environmental Engineering Postdoc
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experimental approaches for structural biology (e.g., cryo-electron microscopy/tomography, X-ray crystallography) is a significant plus. Experience with antibody engineering (e.g., expression, stability, binding
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The interdisciplinary lab of Dr. Peixuan Guo at The Ohio State University seeks a recently graduated Ph.D in biophysics to work on RNA nanotechnology, RNA structure and function, TIRF imaging, optical tweezers (both
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National Aeronautics and Space Administration (NASA) | Pasadena, California | United States | 5 days ago
structure engineering and passivation of silicon-based photodetectors [1, 2]. Developments in recent years has been geared toward wafer-scale processing as well as improving the space worthiness of MBE