165 design-"https:"-"https:"-"https:"-"Institut-Agro-Rennes-Angers" uni jobs in Netherlands
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-design-and-fabric… Requirements Additional Information Website for additional job details https://www.academictransfer.com/359859/ Work Location(s) Number of offers available1Company/InstituteTU
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Location ESTEC, Noordwijk, Netherlands Description Initiated in 2017, the NAVISP programme has been operational for almost nine years. In that time, it has become a key enabler for innovation and
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Vacancies EngD position: Design tool for tire-snow performance predictions Key takeaways Background Winter tires are characterized by excellent performance at cold temperatures and in snowy
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Listen Published Monday 9 Mar 2026 Deadline Sunday 5 Apr 2026 Work area Research, development, innovation Organisational unit Engagement & Research Services (ERS) Salary € 5.705 - € 7.297 Employment
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experimentally, followed by further model improvements, and implementation or design of a robust workflow and predictive design tool. Where to apply Website https://www.academictransfer.com/en/jobs/359149/engd
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7 Jan 2026 Job Information Organisation/Company Eindhoven University of Technology (TU/e) Research Field Engineering » Civil engineering Engineering » Design engineering Researcher Profile
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that takes responsibility for the full life cycle of structures of non-fossil-fuel aircraft. Job description The position offers the opportunity to develop a research line in life cycle design of aeronautical
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9 Jan 2026 Job Information Organisation/Company Eindhoven University of Technology (TU/e) Research Field Architecture » Design Researcher Profile Leading Researcher (R4) Established Researcher (R3
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trends and the industrial landscape Project support experience in a relevant domain Experience in the preparation of procurement activities for technology development and innovation, such as statements
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techniques, along with mathematical modelling approaches for dynamical systems are key areas of interest. You could give special attention to meso-scale applications, design challenges, interface problems, and