92 information-security-"https:"-"https:"-"https:"-"IFM" Fellowship positions in Hong Kong
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The Hong Kong University of Science and Technology (HKUST) is a world-class research institution. It is ranked No. 11 in Asia by the QS World University ranking and No. 44 in the world. Located in
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of and working experience in BLE system design, AI data analysis and mechanical system design; and (c) good command of written and spoken English for conducting literatures review, data reporting and
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james.chungwai.cheung@polyu.edu.hk for further information. Conditions of Service A highly competitive remuneration package will be offered. The closing date for application is 11 August 2026. Apply Now Posting date: 12
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pai.zheng@polyu.edu.hk for further information. Conditions of Service For full-time appointment, a highly competitive remuneration package will be offered. For part-time appointment, the remuneration rates
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-temperature coatings. Applicants are invited to contact Prof. Ruan Haihui at telephone number 2766 6648 or via email at hhruan@polyu.edu.hk for further information. Conditions of Service For full-time appointment, a
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information. Conditions of Service A highly competitive remuneration package will be offered. Consideration of applications will commence on 19 March 2026 until the position is filled. Apply Now Posting date
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projects on-time with minimum supervision. Preference will be given to those with research experience in machines design and development of computer programmes for numerical computation of electromagnetic
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-kl.lam@polyu.edu.hk for further information. Conditions of Service A highly competitive remuneration package will be offered. The closing date for application is 2 February 2026. Apply Now Posting date
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experience at the time of application. Applicants are invited to contact Prof. Qing Li at telephone number 2766 7252 or via email at qing-prof.li@polyu.edu.hk for further information. Conditions of Service A
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kam.kh.ng@polyu.edu.hk for further information. Conditions of Service A highly competitive remuneration package will be offered. The closing date for application is 23 February 2026. Apply Now Posting date