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combining and testing Wide Bandgap (WBG) chips and various semiconductor components as complete system solutions. SiPFAB enables the development and experimentation of future-oriented, environmentally
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fixed-term period of 4 years and is connected to TAU’s PROFI8 profiling actions and focuses on fundamental technology and methods development for next-generation semiconductor packaging and heterogeneous
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directly linked to the development of the EU-level pilot line SiPFAB, which has received 40 M€ of funding to advance high-power semiconductor device packaging technologies. The selected candidate will
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