Sort by
Refine Your Search
-
, including both chip-to-wafer (C2W) and chip-to-chip (C2C) approaches. Core technical directions Heterogeneous integration of wide-bandgap (WBG) electronic components (e.g., GaN/SiC and related platforms
-
. Please note that interviews will not be conducted. For more information, please go first to Frequently Asked Questions We offer We offer a research-inspiring work environment with an excellent up-to-date
Enter an email to receive alerts for chip "https:" positions