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at the University of Sheffield. The successful candidates will take forward methodological research in the engineering of multi nuclear RF coils for applications hyperpolarised with 1H, 129Xe, and other nuclei and
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Number P260053 Posting Link https://www.ubjobs.buffalo.edu/postings/61596 Employer State Position Type UUP Professional Professional Appointment Term Salary Grade SL2 Posting Detail Information Position
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About SUNY Polytechnic Institute: The Research Foundation for The State University of New York (RF) is the largest comprehensive university-connected research foundation in the country. Our mission
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information about the University, visit: http://www.csun.edu About the College: The College of Engineering and Computer Science seeks to be a recognized center for excellence for baccalaureate and master’s
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California State University, Northridge | Northridge, California | United States | about 5 hours ago
% are Native American, and 0.1% are Native Hawaiian or Pacific Islander. For more information about the University, visit: http://www.csun.edu About the College: The College of Engineering and Computer
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, and Jason Widegren https://www.nist.gov/programs-projects/electric-acoustic-spectroscopy-intermolecular-interactions-solution#OnChip NIST’s Material Measurement Laboratory (MML) and Communications
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University (NU) seeks a Senior RF Engineer to support and lead projects within the Assured Communications and Electromagnetic Dominance (ACED) technical thrust area. This position focuses on the design
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at the University of Sheffield. The successful candidates will take forward methodological research in the engineering of multi nuclear RF coils for applications hyperpolarised with 1H, 129Xe, and other nuclei and
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Position Details Position Information Requisition Number Stu04946P Home Org Name RFID Lab at Auburn University Division Name College of Business Position Title RFID Lab – Software Engineer
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an experienced engineer or research scientist specializing in the testing and characterization of photonic integrated circuits, with strong hands-on experience at die level, wafer level, and packaged level. The