55 phd-scholarship-for-solid-mehanical-engineering-in-image-processing Postdoctoral positions at Stony Brook University
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or Biomedical Engineering or a closely related field. Preferred Qualifications: PhD in medical applications of physical sciences and engineering. Experience in medical imaging, breast x-ray imaging, image
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or Biomedical Engineering or a closely related field. Preferred Qualifications: PhD in medical applications of physical sciences and engineering. Experience in medical imaging, breast x-ray imaging, image
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artificial intelligence with a preferred focus on computer vision and medical image analysis. Preferred Qualifications: PhD in Medical Physics, Bioengineering, Biomedical Engineering, Physics, Computer Science
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Postdoctoral Associate Required Qualifications: (as evidenced by an attached resume) ● PhD (or foreign equivalent) in hand by May 2026. ● Strong background in neuroscience. ● Solid
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Job Description Required Qualifications: (as evidenced by an attached resume) * PhD (or foreign equivalent) in hand by May 2026. * Strong background in neuroscience. * Solid experience in molecular and
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Postdoctoral Associate Required Qualifications: (as evidenced by an attached resume) ● PhD (or foreign equivalent) in hand by May 2026. ● Strong background in neuroscience. ● Solid
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hand by the start of the appointment. Preferred Qualifications: Strong background in one or more of the following areas: (1) image processing, (2) weak gravitational lensing, (3) coding and software
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hand by the start of the appointment. Preferred Qualifications: Strong background in one or more of the following areas: (1) image processing, (2) weak gravitational lensing, (3) coding and software
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artificial intelligence with a preferred focus on computer vision and medical image analysis. Preferred Qualifications: PhD in Medical Physics, Bioengineering, Biomedical Engineering, Physics, Computer Science
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Computer Engineering or a closely related field, completed by the start date of the appointment. U.S. citizenship is required. Research experience in at least one of the following areas: ● Chip design