12 phd-in-composite-materials Fellowship positions at Hong Kong Polytechnic University
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project - “Multifunctional aerogel-based integrated interleaves for future aerospace-graded carbon fibre reinforced polymer composites: design and related mechanisms”. Qualifications Applicants should have
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the project leader in the research project - “Sustainable multifunctional composites: Valorising recycled concrete fines, rice husk ash, and biochar as pozzolanic fillers and SCMs for circular construction
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assist the project leader in the research project - “The impact of digital technology implementation on carbon emission reduction in the textile manufacturing industry”. He/She will be required to: (a
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editing”. Qualifications Applicants for the Postdoctoral Fellow post should have a PhD degree in Computer Science, Electrical and Computer Engineering or a related discipline or an equivalent qualification
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reports of the project and academic papers; and (f) perform any other duties as assigned by the project leader or his/her delegates. Qualifications Applicants should have: (a) a PhD degree preferably
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centre for fiber innovations and renewable materials”. He/She will be required to: (a) conduct research in sustainability in fashion business; and (b) perform any other duties as assigned by
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Applicants should have a doctoral degree or an equivalent qualification in Biomedical Science, Bioengineering, Biomedical Engineering, Electronic Engineering, Computing, Materials Science, or related areas and
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Assistant, applicants should have an honours degree or an equivalent qualification. For all posts, applicants should have a strong background in materials processing technologies, especially for light alloys
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Applicants should have: (a) a doctoral degree in Mechanical Engineering or Materials Science and must have no more than five years of post-qualification experience at the time of application; (b) rich
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more than five years of post-qualification experience at the time of application. Preference will be given to those with related material processing and 3D printing research experience. Applicants are invited