Sort by
Refine Your Search
-
Listed
-
Country
-
Field
-
schools and education platforms. For detailed information about the XJTLU Entrepreneur College (Taicang), please visit: https://www.xjtlu.edu.cn/en/study/departments/entrepreneur-college-taicang/ ABOUT THE
-
Professor of Power Electronics and Integrated Magnetics for Future High Performance Computing and AI
national semiconductor strategy. Tyndall is recognised as an international research leader in nanotechnology, microelectronics, photonics, electronics and AI semiconductor, chip and digital technologies
-
Energy Chair professorship, research areas of interest include but are not limited to the following: energy generation and storage, power quality, carbon reduction, microelectronics, secure and resilient
-
Microelectronics to make a significant impact to the UK’s ability to integrate a wide range of electronic circuits to produce complex system architectures. The University of Sheffield is leading a key national
-
Microelectronics to make a significant impact to the UK’s ability to integrate a wide range of electronic circuits to produce complex system architectures. The University of Sheffield is leading a key national
-
worldwide with world-class expertise and instrumentation for multidisciplinary nanoscience and nanotechnology. Learn more about CNM themes at: https://cnm.anl.gov Focus Areas (expertise in one or more is
-
microelectronics, automotive electronics, highway research, robotics and autonomous systems, metallurgy and materials, asphalt technology, pulp and paper, transportation, energy technology, detection and food safety
-
engineering bio-statistics and AI-healthcare smart/semi-conductor manufacturing AI/robotics/autonomous systems aerospace and microelectronics engineering energy generation and storage digital business and
-
by its rising international repute, state-of-the-art teaching and research facilities, and the establishment of three State Key Laboratories in microelectronics, Chinese medical sciences, and internet
-
for Heterogeneous Integration Research in Packaging (CHIRP), Center for Advanced Microelectronics Manufacturing (CAMM), Integrated Electronics Engineering Center (IEEC), Energy Smart Electronic Systems (ES2) center