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(photolithography, metal evaporation, etching) Experience with packaging schemes such as flip-chip bonding, anisotropic conductive film bonding and wire bonding Finite element Method (FEM) simulations (MEMS, Electro
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experience related to the position Experience leading end-to-end development of microfluidic or micro-manufactured devices: design (CAD/CAM), analysis (FEM), fabrication, and assembly/sealing of small-scale
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, anisotropic conductive film bonding and wire bonding Finite element Method (FEM) simulations (MEMS, Electro-static and Quasi-static simulations) Discrete electronic design (Analog and digital design using COTS
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