Sort by
Refine Your Search
-
Listed
-
Country
-
Program
-
Employer
- CNRS
- Carnegie Mellon University
- FAPESP - São Paulo Research Foundation
- Technical University of Denmark
- University of Utah
- AALTO UNIVERSITY
- Aalborg Universitet
- Aalborg University
- Aridditive
- Fraunhofer-Gesellschaft
- Georgia Southern University
- Heriot Watt University
- Illinois Institute of Technology
- Imperial College London
- Imperial College London;
- Instituto de Engenharia Mecânica
- Lunds universitet
- Nanyang Technological University
- National Institute of Research and Development for Electrochemistry and Condensed Matter
- National Renewable Energy Laboratory NREL
- Nature Careers
- Texas A&M University
- The University of Southampton
- University of Minnesota
- University of Oxford
- University of Oxford;
- Vrije Universiteit Brussel
- 17 more »
- « less
-
Field
-
, Applied Mathematics, Physics, Acoustics, Computational Science or a closely related discipline. Strong experience in numerical/computational modelling (e.g., FEM/multiphysics, wave propagation
-
III-V (AlGaAs or InP) semiconductors and SiN photonic platforms Strong background in nonlinear optics or integrated laser physics Experience with photonic device design (e.g., Lumerical, FDTD/FEM tools
-
collaborators. The activities will include: • Electromagnetic modeling and numerical simulations (e.g., FDTD, FEM) • Design of metasurface architectures based on dielectric materials available at CRHEA
-
National Institute of Research and Development for Electrochemistry and Condensed Matter | Romania | 4 days ago
of materials. • Numerical simulation (CAE) of fluid dynamic behavior using finite element analysis (FEM) and strength criteria. • CAD design (Catia V5, Ansys). Important skills include openness to learning and
-
systems Design and execute experiments involving ultrasonic, electromagnetic, and other NDE techniques Develop and apply computational models (e.g. FEM and/or wave propagation models) for material
-
polymers, Injection moulding, extrusion, extrusion-based 3D printing, direct ink writing, finite element method (FEM). Specific Requirements Scientific knowledge in: Processing and manufacturing of polymers
-
collaborators. The activities will include: • Electromagnetic modeling and numerical simulations (e.g., FDTD, FEM) • Design of metasurface architectures based on dielectric materials available at CRHEA
-
(photolithography, metal evaporation, etching) Experience with packaging schemes such as flip-chip bonding, anisotropic conductive film bonding and wire bonding Finite element Method (FEM) simulations (MEMS, Electro
-
Engineering of the State University of Campinas (FEM-UNICAMP). This opportunity is open to candidates of any nationality. The selected candidate will receive a FAPESP Post-Doctoral fellowship in the amount of R
-
under thermomechanical fatigue (TMF) using the finite element method (FEM). One part of the project involves combining experimental investigations and FE simulations of damage behaviour at the macroscopic