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(photolithography, metal evaporation, etching) Experience with packaging schemes such as flip-chip bonding, anisotropic conductive film bonding and wire bonding Finite element Method (FEM) simulations (MEMS, Electro
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experience related to the position Experience leading end-to-end development of microfluidic or micro-manufactured devices: design (CAD/CAM), analysis (FEM), fabrication, and assembly/sealing of small-scale
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, anisotropic conductive film bonding and wire bonding Finite element Method (FEM) simulations (MEMS, Electro-static and Quasi-static simulations) Discrete electronic design (Analog and digital design using COTS
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computational mechanics, FEM/Particle methods, time integration and analysis (60%); -help to write quality research proposals to government agencies and industry, prepare/assist in journal research papers/book
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heavy software development component. The successful candidate will perform research in the application of machine learning (ML) techniques to the finite element method (FEM) in the context of composites
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heavy software development component. The successful candidate will perform research in the application of machine learning (ML) techniques to the finite element method (FEM) in the context of composites
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) Corrosion behavior (electrochemistry & high-temperature oxidation) In-situ monitoring of AM processes Computational skills in: Phase-field modeling, Machine Learning, FEM, DEM, COMSOL Alloy design (CALPHAD