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Framework Programme? Horizon Europe - ERC Reference Number HE-ERC-2023-CoG-10123888-SCRIBE M.Güell:RNA-based gene writi Is the Job related to staff position within a Research Infrastructure? No Offer
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Fellow Campus Columbia Work County Richland College/Division College of Engineering and Computing Department CEC Electrical Engineering Anticipated Hiring Range To commensurate with qualifications Location
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Deadline 4 Feb 2026 - 00:00 (UTC) Type of Contract Permanent Job Status Full-time Is the job funded through the EU Research Framework Programme? Not funded by a EU programme Is the Job related to staff
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%). You will work on the extension of the DUNE-FEM package to support computations on GPU hardware with various types of Finite Element methods. This work is embedded in a research project considering
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17 Jan 2026 Job Information Organisation/Company IMT MINES ALES Research Field Engineering » Systems engineering Computer science » Digital systems Researcher Profile First Stage Researcher (R1
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Scott Wakely. The primary focus will be data analysis and interpretation, along with hardware refurbishment for the High-Energy Light Isotope eXperiment (HELIX) payload, a superconducting magnet
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– Hardware & Electronics Qualifications: PhD in Experimental Particle Physics or related field Preferred Qualifications Physics analysis at the graduate level, prior hardware or electronics work. Cryogenic
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National Aeronautics and Space Administration (NASA) | Fields Landing, California | United States | 28 days ago
Postdoctoral Program website for application instructions and requirements: How to Apply | NASA Postdoctoral Program (orau.org) A complete application to the NASA Postdoctoral Program includes: Research proposal
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Application Deadline 30 Apr 2026 - 00:00 (UTC) Type of Contract Other Job Status Full-time Is the job funded through the EU Research Framework Programme? Not funded by a EU programme Is the Job related to staff
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hardware accelerators, or quantum information science. Responsibilities and Qualifications Your primary responsibilities will be centered around the fabrication and characterization of TFLN/TFLT PICs