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EIA staff, as well as receive additional support to effectively accomplish internship goals. Appointments will involve projects focused on software engineering. Stipends The DOE Scholars Program
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interpretable approach that combines optical and electrical measurements on a single chip. Funding category: Contrat doctoral PHD Country: France Where to apply Website https://www.abg.asso.fr/fr/candidatOffres
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As part of the PICs@ICFO Strategic Initiative, ICFO coordinates PIXEurope, a flagship Pilot Line funded under the European Chips JU program. With €400 million in investments and a consortium of 20
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10 Apr 2026 Job Information Organisation/Company Università degli Studi di Perugia Research Field Engineering Researcher Profile Recognised Researcher (R2) Leading Researcher (R4) First Stage
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, packaging & co-packaged optics Design of low loss passive components (Si, SiN, …) for scalable photonic systems Development of chip-to‑chip and chip‑to‑fiber coupling structures Technology pathfinding for co
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Brain-Computer Interfaces Biomaterials and Biomanufacturing Organoids and Organ-on-a-Chip Technology Medical Imaging Medical Instruments and Robotics Multi-Omics, Bioinformatics, and AI for health
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and study in this innovative environment. Click here to go to the website of the Faculty of Electrical Engineering, Mathematics and Computer Science. Conditions of employment Duration of contract is 2
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the undergraduate and graduate levels. Where to apply Website https://www.bth.se/english/vacancies/job/phd-student-position-in-software-engin… Requirements Research FieldComputer science » Computer systemsEducation
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15 Apr 2026 Job Information Organisation/Company Czech Technical University in Prague Department Department of Electromagnetic Field Research Field Technology » Computer technology Researcher
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and 7 Master’s degrees to over 6,300 students across seven academic departments that include: Aerospace Engineering, Chemical and Materials Engineering, Civil Engineering, Electrical and Computer