Sort by
Refine Your Search
-
Listed
-
Country
-
Field
-
call is computer vision and machine learning, with a focus on 3D mapping methods for audio. The project explores how to rethink such systems by constructing end-to-end methods that combines detec-tion
-
3-D animation and interactive media that may include 2D and 3D digital arts, 2D and 3D animation, narrative art, history and theory of animation and interactive media, motion graphics, VR and AR art
-
Animation (2D/3D) Motion Graphics Audio-Visual Production Interactive Media Video Editing & Post-Production UI/UX Fundamentals (if applicable) Conduct practical lab sessions and studio critiques Guide student
-
months of professional animation experience 24 months of professional illustration experience 24 months of professional 3D modeling experience 12 months of video production experience 12 months of audio
-
or more digital mediums: games, sound, music, recording, mixing and mastering, games, video, web, motion graphics, programming, interactivity, 2D/3D, animation, and/ or live performance. The job may also
-
funded by a EU programme Is the Job related to staff position within a Research Infrastructure? No Offer Description Project title (thesis topic) : Underwater sound control with bubble metascreens Summary
-
animation experience 24 months of professional illustration experience 24 months of professional 3D modeling experience 12 months of video production experience 12 months of audio production experience
-
experience in areas including non-linear video editing, motion graphics, video lighting and composition, camera operation, graphics design, audio recording, video production, or a closely related professional
-
(i) Geometry and computer vision (including analysis of video, audio, radio, and radar signals), (ii) Medical image analysis, and (iii) Machine learning/artificial intelligence. The group boasts
-
, 3D-integrated compute systems in which logic, memory, power delivery, and interconnect are co-designed across heterogeneous technology tiers. Realizing CMOS 2.0 in silicon depends on tightly coupling