Sort by
Refine Your Search
-
Category
-
Country
-
Field
-
Researcher, you will play a key role in developing next-generation quantum sensors based on photonic technologies, with applications spanning high-tech industries, space, and defense. Your work will focus
-
, you are involved in research activities where Die to wafer bonding is required (3D integrated systems, image sensors, photonics, biomedical devices, quantum computing,...). More specifically, you will
-
. Collaborating closely with component experts, we innovate at the system level to advance these technologies and bridge the gap between research and industry. Each system integrates a novel microchip or sensor
-
that develops advanced AI compute solutions involving AI models, algorithms, implementations, sensors and hardware for small scale edge up to large scale distributed and hybrid hardware architectures
-
with AI inside HPC applications is considered a plus. Experience with performance modeling (such as computer architecture simulation) for multiple types of computer hardware (e.g. CPU/GPU/NPU, or network
-
R&D hub in Leuven. Opportunities to collaborate with leading circuit designers, device experts, and integration engineers. Visibility through publications and engagements with imec’s global network
-
into a globally recognized program and early-stage investor, boasting a portfolio of over 350 startups and scaleups, along with an extensive network of partners and mentors. The focus of imec.istart is on