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Professor of Power Electronics and Integrated Magnetics for Future High Performance Computing and AI
semiconductor processing, microscopy, quantum technologies, heterogeneous integration, ultra-high speed optical communications and RF through THz characterisation. A substantial research start-up package is
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semiconductor processing, microscopy, quantum technologies, heterogeneous integration, ultra-high speed optical communications and RF through THz characterisation. A substantial research start-up package is
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photonics group investigates light-matter interaction in a broad range of frequencies, from the visible to the THz. This interaction is enhanced by resonant structures, such as metallic or dielectric
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, Future Energy Systems and Advanced Materials, Electronics and Communications) and eight Research Nodes which group staff under technical expertise and interest (see https://www.durham.ac.uk/departments
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to characterize 2D materials, semiconductor devices, and biological materials from DC to the THz regime. The measurements enable the engineering of dielectric, magnetic and electrical transport properties of thin
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for mobile wireless links. The postdoc will also work closely with international collaborators, through (among other possibilities) research visits to other research labs on sub-THz and LEO satellite networks
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and commissioning of a 2D-THz instrument based on a commercial novel 25 fs, >3mJ laser system. • Conduct benchmark experiments on new magnetic systems in collaboration with the MRSEC CHARM center (https
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Posting Details Position Information Position Title Empire Innovation Professor, Electrical Engineering Department Department of Electrical Engineering Posting Number F250114 Posting Link https
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interface their research with the department's existing strengths in communications/signal processing, wireless networks, RF/microwave/THz engineering, IoT, AI, cybersecurity, and computer engineering. The
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external research funding and who can interface their research with the department's existing strengths in communications/signal processing, wireless networks, RF/microwave/THz engineering, IoT, AI