Sort by
Refine Your Search
-
Listed
-
Category
-
Country
-
Program
-
Field
-
. Our team has pioneered a thin-film lift-off process for AlGaN materials using electrochemical etching, enabling integration with high-quality photonic structures. This has led to world-first
-
science or related fields Solid knowledge in semiconductor materials, epitaxy, and thin film characterization (experience in any of these areas is a plus) Interest in quantum information science and quantum
-
XUV Magneto-Optical Kerr Effect (MOKE) scattering, facilitating element-specific ultrafast magnetic studies in thin films, magnetic alloys, and 2D magnetic materials, with temporal resolution enabled by
-
Details Posted: Unknown Location: Salary: Summary: Summary here. Details Posted: 23-Oct-25 Location: Stanford, California Type: Full-time Categories: Staff/Administrative Internal Number: 107592
-
through a set of gates, the charge carrier density in a thin, doped Si region can be controlled, enabling the fabrication of gate-tunable silicide/Si/silicide junctions. Moreover, various techniques from
-
Demonstrated excellent experimental and analytical skills Basic command of programming (Python). Knowledge of thin film deposition and characterization techniques is a pre. Good communication skills Able to work
-
Project in EU: DC 1: a-SiC deposition by Hot Wire Chemical Vapor Deposition (HWCVD) - Host institution: CNRS (FR) DC 2: Optimization of a-SiC thin films for photonic applications - Host institution: CNRS
-
. New optical waveguide technologies that have emerged in the last decade are thin-film lithium niobate, -tantalate and III-V large bandgap semiconductors such as gallium phosphide, which unlock new
-
the Fresnel Institute (optical thin film deposition, signal processing, optical component modelling) and outside (polymer deposition and nanostructuring, biological applications). The candidate will play
-
discipline Hands-on experience working with some of the following semiconductor device fabrication equipment/processes in a cleanroom environment: e-beam lithography; atomic layer deposition; thin film metals