Sort by
Refine Your Search
-
will facilitate the comprehensive characterization of microelectronics under various conditions, including thermal, mechanical, and radiation stresses. The software developed through this project will
-
that are broadly applicable across the physical sciences but applied initially to x-ray characterization needs. They will publish results in high impact journals, present at conferences and work with the software
-
in GPU programming one or more parallel computing models, including SYCL, CUDA, HIP, or OpenMP Experience with scientific computing and software development on HPC systems Ability to conduct
-
. Work with T&D software (e.g., OpenDSS, PSS/E) to gather data, run simulations, and assess grid-wide impacts. Additionally, candidates will: Collaborate with multidisciplinary teams to develop innovative
-
. Familiarity with techno-economic analysis. Experience with scientific programming languages (e.g., R, Python, Java) and statistical software (e.g., Stata). Ability to create visualizations to effectively
-
successful applicants must provide proof of U.S. citizenship, which is required to comply with federal regulations and contract. Preferred Qualifications: Proficiency in GIS software and tools, with experience