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support research in: • Transportation systems modeling and simulation, including O/D modeling, multimodal network modeling, agent-based or behavioral modeling • Large-scale computing, cloud-native analytics
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records, biomarkers, omics data, registry data, and sensor data such as CGM measurements (continuous glucose monitoring), activity trackers, and other wearable sensors. Contribute to grant proposals and
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-year contract starting September/October 2026 https://www.eu4greenfielddata.eu/ APPLICATIONS OPEN ON Juanary 5th 2026 Are you an aspiring researcher ready to drive the digital and green transition in
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Interface of Optical Ground Station Free space and OGS quantum connections to Fibre Network Share this opening! Use the following URL: https://jobs.icfo.eu/?detail=1071
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Framework Programme? Not funded by a EU programme Is the Job related to staff position within a Research Infrastructure? No Offer Description Teaching School : Grenoble INP – ENSE3 School website: http: https
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Essential Application Experience creating data dashboards and visualisation tools for engineering applications. Essential Application/Interview Practical experience in sensor networking and IoT integration
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Job related to staff position within a Research Infrastructure? No Offer Description Background CUSTOM is an EU MSCA Doctoral Training Network connecting relevant academic and industrial expertise in
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SPEAR Centre: PhD in ‘Long-Range, High Bandwidth Distributed Acoustic Sensing for Fibre Optic Links’
to support growth in sectors such as healthcare, telecommunications, advanced manufacturing, and sensor networks. The position is available at Tyndall National Institute in Cork. Project Description
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future-proof. At the same time, we are developing the chips and sensors of the future, whilst also setting the foundations for the software technologies to run on this new generation of equipment – which
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lives. Technology such as the electricity grid, which our faculty is helping to make completely sustainable and future-proof. At the same time, we are developing the chips and sensors of the future