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) a novel dual scanning thermal and electron microscopy (SThM-SEM) instrument equipped with a cooling stage to bring the sample to a temperature varying from 100 K to 300 K and to use the new NbN SThM
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scanning electron microscopy (SEM) and electron backscatter diffraction (EBSD) as well as sample preparation using a focused ion beam (FIB) for transmission electron microscopy (TEM). Established record
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: nanolithography, quantum science and engineering, optics, nanocharacterization methods such as, STM, AFM, and SEM Additional Information Benefits We offer Our institution is based on an interdisciplinary
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of novel thin-film materials for spin-orbitronic applications. Hands-on Training Includes: Magnetron sputtering Nanofabrication (photolithography, e-beam) Material characterization (XRD, AFM, XPS, SEM, TEM
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CNTs via CVD using varied catalyst formulations and growth conditions. Characterize CNTs using Raman spectroscopy, SEM/TEM, and elemental analysis. Investigate the influence of catalyst impurities (e.g
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. Nanoscale characterization: You will validate your lithographic patterns using advanced microscopy methods such as SEM, AFM, and TEM, ensuring reproducibility, uniformity, and sub-15 nm precision. Quantum
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these fields is advantageous: Atomic layer deposition, sputtering, XRD, XRR, XPS, SEM. Excellent written and spoken English, knowledge of German is an advantage. Our benefits International and interdisciplinary
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-mentioned research project Preparation and characterization of copper- and gold-based catalysts (e.g., XRD, XPS, Raman, UV-Vis, SEM/TEM) Investigation of spatially resolved catalytic behavior in a profile
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link structure-property relationships from DFT, MD, phase-field, TEM/SEM, and other multimodal datasets from simulation and experiment Develop benchmarking protocols and toolkits to evaluate AI models
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), operando sensing, and ageing tests will be conducted at UoB. At BAM, detailed post-mortem characterisation—including SEM, XPS, ToF-SIMS, Auger, and calorimetry—will reconstruct SEI composition, porosity, and