96 structures-"https:"-"https:"-"https:"-"https:"-"https:"-"https:"-"https:"-"Dip" positions at University of Texas at Austin
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develop innovative semiconductor circuits and test structures to support TIE's facility manufacturing highly reliable and leading-edge 2.5D and 3D packaging solutions. This position will also manage and
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knowledge graphs and multimodal embeddings for cancer patient digital twin construction. Lead and co-author high-impact publications and grant proposals. Collaborate with clinicians, bioinformaticians, and
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resolve excursion through structured troubleshooting and investigation of failure modes. Design and evaluate results of experiments on test vehicles for mechanical / electrical performance and reliability
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/31/2025. Purpose The Senior Data (Technology) Architect & Analytics Lead will be a key member of UT-HIP program and Dell Medical School, focusing on the design and implementation of data structures and
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are bringing advanced semiconductor 3DHI packaging/manufacturing back to the USA and looking for motivated individuals to join our team. Purpose Responsible for IC & Test Structure product validation and
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structure layouts to help drive next generation processing capabilities across a wide range of materials. Support TIE's standard cell offerings and drive validation/simulation/emulation capability around