146 structures-"https:"-"https:"-"https:"-"https:"-"Simons-Foundation" positions at NIST
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of new and existing structures, (4) applying the Fiber Reinforced Polymer (FRP) retrofit design to improve the performance of existing structures, (5) studying the feasibility of using high strength
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elements with sub-wavelength periodicity (“high-contrast gratings”) as optomechanical elements. Such structures enable a rich variety of devices, including mirrors, polarizers, and filters in a configuration
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, biopharmaceuticals, and vaccines. Topics of particular interest include the effects of post-translational modifications (PTMs) on protein dynamic structure and protein-ligand interactions, structure-function
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characterization techniques to determine processing-structure-property relations that occur during processing, including scanning and transmission electron microscopy, thermal analysis, and x-ray diffraction
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are developing microfluidics to measure material properties and structure. Protein, polymer and surfactant solutions and suspensions and emulsions are being characterized using computer-controlled microfluidic
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for AM, and for identifying suitable approaches for integrating these surrogate models into an AI/UQ framework. This capability is expected to provide a detailed understanding of the structure/property
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the structural changes of materials during indentation deformation. Recently, this methodology has been employed in in-situ studies on the phase transformation of crystalline and amorphous silicon thin films and
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temperature and velocity data to provide a complete picture of the physics and chemical structure of the environment within the fire enclosure. Measurements will be completed for a variety of fuel types and
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Jeffrey Alan Fagan jeffrey.fagan@nist.gov 301.975.6740 Ming Zheng ming.zheng@nist.gov 301.975.8995 Description Single-wall carbon nanotube (SWCNT) species as materials display exceptional nanotube-structure
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traditional thin-film devices include exceptional structural quality, high surface-to-volume ratio, bottom-up device engineering with high-density on-chip integration, and utilization of quantum size effects