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on the layouts and integration schemes, 3D structures are simulated in TCAD then used to produce electrical compact models for both the device and the RC parasitics due to the metal interconnects. These models
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current maskset specifications, defining design rules, and check them structurally and electrically. You will report your results internally to program managers, program director and within multi-functional
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analysis Thermal integrity in 2.5D packaging Advanced design technology co-optimization Parasitic extraction for large cells Area-selective deposition for nanoscale structures ...and more! By bridging
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