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multilayer printed circuit boards (PCBs). It draws from disciplines including electrical and electronic engineering, embedded systems, computer vision, and cybersecurity. The ability to verify hardware without
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metascintillator prototypes towards clinical application. The research will combine experimental surface engineering, advanced materials characterisation (SEM, XRD, spectroscopy), and performance testing alongside
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are part of the programme. The research is funded by the Centre of Propulsion and Thermal Engineering at Cranfield University. The work will be conducted at the Cranfield icing wind tunnel (IWT) based
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additive manufacturing. This project will be closely aligned with the ATI research program (I-Break: Wire-based DED Technology Maturation and Landing Gear Application) and other industrial research projects
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technology, management, defence and security. Cranfield is recognised for delivering outstanding research addressing contemporary global challenges with economic, environmental, and social impact for business
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research program (I-Break: Wire-based DED Technology Maturation and Landing Gear Application) and other industrial research projects within WAMC. The student will become part of a diverse and dynamic
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-assurance positioning in safety-critical applications. Cranfield is a specialist postgraduate university that is a global leader for education and transformational research in technology, management, defence
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with programming (Python, MATLAB), background in aerospace, computer science, robotics, or electrical engineering graduates, hands on skills in implementation of fusion/learning based techniques in
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systems, and engage in joint projects with green electronics laboratories across Europe and Asia. The programme supports attendance at major conferences like ISLPED, ICCAD, and PATMOS, and includes
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project would suit students with a background in electronics, embedded programming, signal processing, vibration measurement and analysis, maintenance engineering, and electro-mechanical engineering