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semiconductor structures, exfoliation and stacking of two-dimensional materials and fabrication of vdW heterostructures, clean-room processing (reactive ion etching, optical/electron beam lithography, scanning
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processing (reactive ion etching, optical/electron beam lithography, scanning electron microscopy, atomic force microscopy, metal evaporation, wire bonding), performing computer-based simulations and modelling
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techniques (e.g., electron-beam lithography, dry/wet etching, metal deposition). • Background in low-temperature transport measurements or optical characterization of materials and devices. Appointment Details
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