858 engineering-computation "https:" "https:" "https:" "https:" "https:" Fellowship positions
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Graduate Program (TIGP) and hosts the Molecular Science and Technology Program (TIGP-MST) for international graduate students (https://tigp.iams.sinica.edu.tw/ ). We look forward to your applications and the
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20 Feb 2026 Job Information Organisation/Company INESC ID Research Field Engineering » Computer engineering Researcher Profile First Stage Researcher (R1) Positions Master Positions Application
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) – Alternate Member; Dr. Vera Inácio Cordeniz, Science and Technology Manager (CESEM/NOVA FCSH) – Alternate Member. Additional comments Draft_ scholarship_contract: https://www.fcsh.unl.pt/static/documentos
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DigiQ (the Digitally Enhanced Quantum Technology Master) is a European initiative to enhance Quantum technology education in Europe. As Europe´s largest Quantum education project, DigiQ aims
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non-degree awarding program; Preferential factors: Experience in in the application of ohmic heating technology and/or electric fields in food processing and extraction processes Workplan and objectives
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20 Feb 2026 Job Information Organisation/Company INESC ID Research Field Engineering » Computer engineering Researcher Profile First Stage Researcher (R1) Positions Master Positions Application
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membranes. Please see https://blacklow.hms.harvard.edu/ for additional information on areas of research. We welcome applications from recent PhD graduates who are interested in these or related fields
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. students. IAMS is an active participant in the Taiwan International Graduate Program (TIGP) and hosts the Molecular Science and Technology Program (TIGP-MST) for international graduate students ( https
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20 Feb 2026 Job Information Organisation/Company Politécnico de Leiria Department CIIC - Computer Science and Communication Research Centre, at the School of Technology and Management (ESTG
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schools in the world. For more details, please view https://www.ntu.edu.sg/mae/research . We are looking for a Research Fellow. The role will focus on helping to build thermal-flow engineering and