18 web-programmer-developer-"https:"-"UCL"-"U.S"-"https:"-"University-of-St" Fellowship positions at Hong Kong Polytechnic University
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months] (2) Research Assistant (Full-time / Part-time) [Appointment period: twenty-four months] Duties The appointees will assist the project leader in the research project - “Development of next
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secure, regulatory-compliant development platforms capable of ingesting, curating and continuously learning from multi-center hepatocellular carcinoma datasets; (c) create innovative algorithms/systems
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projects on-time with minimum supervision. Preference will be given to those with research experience in machines designs and development of computer programmes for numerical computation of electromagnetic
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research activities, including project coordination, documentation and reporting; (b) assist in developing research frameworks related to hotel digital intelligence, smart service systems, AI-enabled
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twelve months] Duties The appointees will assist the project leader in the research project - “Develop a vision-language model-based smart driving assistant for enhancing safety and convenience
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to milestones; (d) prepare research reports, documentation, and presentations for internal and external dissemination; (e) contribute to the formulation of innovative strategies that integrate traditional
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months] Duties The appointees will assist the project leader in the research project – “Multi-sensor-based smart sorting (MSS) system for solid waste recycling and sustainable development”. Qualifications
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using Learning Algorithms & Dialog Data (S.H.I.E.L.D.)”. They will be required to: (a) develop machine learning models to predict optimal rehabilitation solutions; (b) use AI algorithms to detect
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the research project - “Development of a novel dendritic cell-targeted vaccination approach for treating mesothelioma”. Qualifications Applicants should have a doctoral degree or an equivalent qualification and
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months] Duties The appointees will assist the project leader in the research project - “Development of intelligent ultra-precision air-bearing hydrostatic spindle for grinding semiconductor wafer