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schools History News 2025 School Introduction Registration Program Recordings Questions Committees Sponsors Contact Repository Lectures by topic Lectures by author Search lectures 2024 2023 2022 2021 2020
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Description of the offer : the Max Planck Institute for the Structure and Dynamics of Matter (MPSD) is looking for a computational scientist for the project "Software Engineering for Magnetic
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Description of the offer : The University seeks to appoint a research associate with expertise on computational techniques in the Department of Computer Science to work on Skyrmionics
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Description of the offer : The University seeks to appoint a research associate with expertise on experimental techniques in the Department of Computer Science to work on an interdisciplinary
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computing and memory-in-logic devices. The PhD student will also benefit from mentorship by TEF, with specific attention to intellectual property aspects.
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schools History News 2025 School Introduction Registration Program Recordings Questions Committees Sponsors Contact Repository Lectures by topic Lectures by author Search lectures 2024 2023 2022 2021 2020
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, and the fundamental physics of spintronic oscillators. Their work also explores the use of these oscillators in unconventional computing hardware, including neuromorphic systems, reservoir computing
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Description of the offer : This project aims to use the magnetostrictive properties of skyrmrion-hosting thin films to control the nucleation, propagation and annihilation of these compact spin textures with surface acoustic waves (SAWs), which are coherent strain waves. Exploiting this...
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Description of the offer : The Spectroscopy of Novel Quantum States team at the Institut des Nanosciences de Paris specializes in low-temperature scanning tunneling microscopy (STM) to study the electronic, topological, and magnetic properties of a wide range of materials, from superconductors...
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topological textures. A wide range of applied functionalities could be considered: terahertz sources, unconventional computing and AI, security components, telecommunications, sensors, memories etc.