89 structural-engineering-"https:"-"https:"-"https:"-"https:"-"https:"-"U.S"-"TCAT-Dickson" positions at NIST in United States
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NIST only participates in the February and August reviews. The future of nanoelectronic technologies requires new device concepts and novel materials. The electronic (band) structure and energy band
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and the biologics are poorly understood. This research opportunity centers on advancing experimental measurement methods to quantify the structure formed between poly(organophosphazene) polyelectrolytes
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RAP opportunity at National Institute of Standards and Technology NIST Lipid Membrane Structure and Dynamics Location NIST Center for Neutron Research opportunity location 50.61.01.B8563
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RAP opportunity at National Institute of Standards and Technology NIST Microscale Mechanical Characterization of Heterogenous Structures in Advanced Packaging Location Material Measurement
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methods which are critical to ensuring structural performance. For more information please visit our website at http://www.nist.gov/mml/infr.cfm/ . Materials; Alternative energy; Fracture; Mechanics
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of structural responses for performance-based seismic engineering of tall buildings. Opportunities include the following: (1) developing improved modeling and analytical capabilities for nonlinear dynamic
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RAP opportunity at National Institute of Standards and Technology NIST Coupling electronic structure methods, artificial intelligence, and data-driven approaches for next-generation quantum
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Computational Methods for NMR Structural Biology and Biomanufacturing of Protein and Live Cell Therapeutics NIST only participates in the February and August reviews. Protein therapeutics
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RAP opportunity at National Institute of Standards and Technology NIST Nanoparticle Engineering, Production, Assembly, and Characterization Location Physical Measurement Laboratory, Nanoscale
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NIST only participates in the February and August reviews. The modern transmission electron microscope (TEM) is capable of atomic-resolution structural and chemical imaging. However, such data