51 web-programmer-developer-"https:"-"UCL"-"P"-"https:"-"University-of-St" Fellowship positions at University of Nottingham in United Kingdom
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Applications are invited for the position of Research Associate/Fellow on Chinese development to contribute to an ERC-supported study at the Nottingham University Business School (NUBS). The purpose
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Research Framework Programme? Horizon Europe - ERC Is the Job related to staff position within a Research Infrastructure? No Offer Description Applications are invited for the position of Research Fellow on
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-holder will be part of the Rights Lab’s ECR community, have access to stakeholder sessions and training and development, and join one of the Lab’s four main research programmes. The role-holder will have
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, an international collaboration developing the world’s first real-time infection-risk management platform for indoor environments. You will contribute to Technical Area 2 (Respiratory Risk Assessment), developing and
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for generating new intellectual understanding/knowledge through the application of knowledge and for developing ideas for application of research outcomes. About the Team The PEMC institute has grown exponentially
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to plan and conduct your own analyses using available tools, to adapt existing methodologies and scripts, and to design new pipelines and workflows that deliver accurate, reproducible, and timely results
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Monaghan (Gastroenterology), and Dr Adam Blanchard (Computational Biology). This is an excellent opportunity to contribute to pioneering translational psychiatry research, while also developing your own
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for application of research outcomes. You will sustain and pursue a strategic research plan with PHIRST-LIGHT, and will develop new concepts and ideas. The successful candidate will be responsible for managing
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contribution to the direction of research programmes in the Power Electronics, Machines and Control (PEMC) Research Institute in the Faculty of Engineering. You will pursue a research plan in developing
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plan in heterogeneous integration-based activities regarding power semiconductor bonding, interconnect, packaging, thermal management and reliability, developing new concepts and ideas. Where