119 structural-engineering-"https:"-"https:"-"https:"-"https:"-"https:"-"INSA-toulouse" positions in Spain
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an experienced engineer or research scientist specializing in the testing and characterization of photonic integrated circuits, with strong hands-on experience at die level, wafer level, and packaged level. The
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microscope, scanning tunnelling microscope, etc For more information about the QTWIST Program: https://qtwist.icfo.eu . Share this opening! Use the following URL: https://jobs.icfo.eu/?detail=890
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EU programme Is the Job related to staff position within a Research Infrastructure? No Offer Description Department: Topographic Engineering and Cartography. Area of Knowledge: Cartographic, Geodetic
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23 Jan 2026 Job Information Organisation/Company Universitat Politècnica de Catalunya (UPC)- BarcelonaTECH Research Field Engineering » Computer engineering Engineering » Communication engineering
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the Grant-Agreement for the promotion and encouragement of research and technology transfer at the Carlos III University of Madrid." Where to apply Website https://aplicaciones.uc3m.es/atenea/publico/1
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application development. We are seeking up to two Process Engineers or Research Scientists with hands-on experience in packaging and assembly of photonic integrated circuits (PICs). The selected candidates will
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/convocatorias/conv-pca-cont-tituladoa… https://sede.uhu.es/opencms/system/modules/sede/contents/pages/tablon Work Location(s) Number of offers available1Company/InstituteSchool of Engineering. CountrySpainState
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projects and business development within the Corporate Development and Technology Transfer department. In particular, tasks will include promotion of international R&D&i competitive-funded projects, mainly
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projects and business development within the Business Development team of the Corporate Development and Technology Transfer department. In particular, tasks will include promotion of international R&D&i
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quantum dot films engineered at the atomic as well as at the supra-nanocrystalline level to address applications related to safety and security, remote sensing, environmental monitoring, thermal imaging etc