1,574 structural-engineering "https:" "https:" "https:" "https:" "https:" "Washington University in St" positions in Spain
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engineering. Research profile: Telematics engineering. Where to apply Website https://rrhh.uib.cat/seccions/PDI/convo/numeraris/ Requirements Research FieldEngineeringEducation LevelPhD or equivalent Additional
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Infrastructure? No Offer Description Pre-doctoral employment contract as research staff in training, see more details of the offer in https://www.upo.es/system/modules/com.saga.upo.sedeelectronica.frontend/handler
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, technology, the humanities and the arts with a clear vocation for cooperation and social responsibility, contributing to the sustainable development of the region and to the critical and engaged education of
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applicants. Website for additional job details https://sede.uhu.es/opencms/system/modules/sede/contents/pages/tablon https://www.uhu.es/personal-tecnico-apoyo/ Work Location(s) Number of offers
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27 Oct 2025 Job Information Organisation/Company Universitat de Barcelona Department OPIR Research Field Engineering Researcher Profile First Stage Researcher (R1) Positions Bachelor Positions
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application development. We are seeking an engineer or research scientist with hands-on experience in either packaging or testing and characterization of photonic integrated circuits (PICs). The selected
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of therapeutic targets. Research Project PI-ISCIII (PI22/01042)", with the destination of the Foundation for Health Training and Research of the Region of Murcia. Where to apply Website https://rrhh.ffis.es/rrhh
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Scientist or Engineer position to an experienced scientist or engineer with demonstrated expertise electro-optical materials, modulators and integration with PICs, ideally in industrial or application-driven
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Technology (IRTA), Autonomous University of Barcelona (UAB), and University of Barcelona (UB). The Center is located at the UAB Campus, and currently hosts 200 members from across the world. Research Programs
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scientist or engineer with a strong background in photonic integrated circuit (PIC) design, process design kit (PDK/ADK/TDK) development, and semiconductor manufacturing workflows. The selected candidate will