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measure the extent of silicon phase transformation and plasticity underneath a silicon micro-scratch, using electron backscatter diffraction or transmission Kikuchi diffraction on focused ion beam lift-outs
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, additional material characterisation with techniques such as X-ray diffraction, X-ray and neutron reflectometry and X-ray photoemesion spectroscopy will be used to provide a fundamental understanding of the
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simultaneous wave interactions, including reflections, diffractions, refraction, and turbulence-induced scattering. Such effects not only complicate noise prediction but also disrupt conventional approaches
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