78 structural-engineering-"https:"-"https:"-"Embry-Riddle-Aeronautical-University" Postdoctoral positions in Germany
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develop more efficient ways to sustainably convert CO2 . This knowledge will be generated in a scale-bridging approach (from the atomic structure of enzymes to the systems level of the cell) through highly
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06.09.2021, Wissenschaftliches Personal The Institute for Communications Engineering is currently offering seven positions for PhD or postdoctoral candidates for the project "6G-life" which is
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functional and phenotypic assays on human T cells (in vitro and ex vivo) Engineer T cells using mRNA delivery platforms via lipid nanoparticles Characterize T cell subsets using multiparametric flow cytometry
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in Germany. Our mission is to ensure safety in technology and chemistry. We perform research and testing in materials science, materials engineering and chemistry to improve the safety of products and
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07.12.2022, Wissenschaftliches Personal The institute for communications engineering offers a position for a doctoral or young postdoctoral candidate with the topic “Communication and coding in
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- PhD student in quantitative verification interested in co-developing Automata Tutor - main developer of Automata Tutor Positions in the Formal Methods for Software Reliability group of TU Munich led by
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degree or PhD in Computer Science, Electrical Engineering, Control Systems, or a closely related field. Experience in reachability analysis, formal verification/model checking, control theory, or related
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: Shortlisted candidates will be invited for a structured interview with predefined questions and a scoring system. Reserve List: A reserve list of top candidates may be created for future opportunities
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Technology, and Smart Data Technologies. Currently, the INP employs about 200 scientists and staff at three locations (Greifswald, Rostock, and Karlsburg). For further information, please visit our website
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The Fraunhofer Institute for Reliability and Microintegration (IZM) is a world-leading research institute in the field of packaging and interconnection technology for microelectronic systems