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and propose relevant follow up actions. You have strong organizational skills and show the flexibility to change between different projects according to changing priorities. You actively look for
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ARM architectures, and different GPU or NPU architectures would be a significant advantage. This role demands excellent communication, leadership, and presentation skills, with the ability
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sensors and vision systems Life sciences Low cost and low power radar sensing systems Photovoltaics Power to Molecules Sensor solutions for Internet of Things Silicon photonics Solid state batteries System
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can interface with them. You are able to adapt to imec’s fast evolving environment where different TRL of different technologies co-exist in the same manufacturing line. You have excellent communication
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between different projects according to changing priorities. Given the international character of imec, excellent English verbal and written communication skills are required to be effective in
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are inherently dissimilar, and have their own unique needs. Trips to the customer site are expected and may involve potentially extended time spent on-site to ensure seamless engagement and support. Where to apply
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flexibility to change between different projects according to changing priorities. Given the international character of imec, excellent English verbal and written communication skills are required to be
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with other experts from different fields to identify codesign solutions and to build the infrastructure required to evaluate them. This position plays a key role in our mission to shape the future
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, you are involved in research activities where Die to wafer bonding is required (3D integrated systems, image sensors, photonics, biomedical devices, quantum computing,...). More specifically, you will