9 algorithm-sensor-"DIFFER" positions at IMEC in Belgium

  • IMEC | Belgium | 3 days ago

    and propose relevant follow up actions. You have strong organizational skills and show the flexibility to change between different projects according to changing priorities. You actively look for

  • IMEC | Belgium | about 1 month ago

    ARM architectures, and different GPU or NPU architectures would be a significant advantage. This role demands excellent communication, leadership, and presentation skills, with the ability

  • IMEC | Belgium | about 2 months ago

    sensors and vision systems Life sciences Low cost and low power radar sensing systems Photovoltaics Power to Molecules Sensor solutions for Internet of Things Silicon photonics Solid state batteries System

  • IMEC | Belgium | 2 months ago

    can interface with them. You are able to adapt to imec’s fast evolving environment where different TRL of different technologies co-exist in the same manufacturing line. You have excellent communication

  • IMEC | Belgium | 2 months ago

    between different projects according to changing priorities. Given the international character of imec, excellent English verbal and written communication skills are required to be effective in

  • IMEC | Belgium | 2 months ago

    are inherently dissimilar, and have their own unique needs. Trips to the customer site are expected and may involve potentially extended time spent on-site to ensure seamless engagement and support. Where to apply

  • IMEC | Belgium | 2 months ago

    flexibility to change between different projects according to changing priorities. Given the international character of imec, excellent English verbal and written communication skills are required to be

  • IMEC | Belgium | 3 months ago

    with other experts from different fields to identify codesign solutions and to build the infrastructure required to evaluate them. This position plays a key role in our mission to shape the future

  • IMEC | Belgium | 3 months ago

    , you are involved in research activities where Die to wafer bonding is required (3D integrated systems, image sensors, photonics, biomedical devices, quantum computing,...). More specifically, you will

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