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/artykul/regulamin-wynagradzania-r… 7. Declaration that the University of Kalisz will be the primary place of work in the event of winning the competition - link to the declaration: https
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Łukasiewicz Research Network - Institute of Microelectronics and Photonics | Poland | about 1 hour ago
of semiconductor structures. Prepare scientific and technical documentation for R&D activities. Write reports on completed work. Participate in the preparation of scientific articles. Attend conferences. Where
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, expectations, comments): The competition may be joined by those who meet the conditions of the Act from 20.07.2018 specified in the Law on Higher Education (t.j. Dz. U. z 2024 r. poz. 1571). CANDIDATES SHOULD
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, expectations, comments): The competition may be joined by those who meet the conditions of the Act from 20.07.2018 specified in the Law on Higher Education (t.j. Dz. U. z 2024 r. poz. 1571). CANDIDATES SHOULD
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of Technology; Personal questionnaire for a person applying for employment at the Lodz University of Technology, constituting Annex No. 1.1 to the "OTM-R POLICY - OPEN, TRANSPARENT, SUBSTANTIVE RECRUITMENT
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University of Technology; personal questionnaire for a person applying for employment at Lodz University of Technology, as provided in Annex no. 1.1 to the OTM-R POLICY - OPEN TRANSPARENT MERIT-BASED
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Annex no. 1.1 to the OTM-R POLICY - OPEN TRANSPARENT MERIT-BASED RECRUITMENT; 4) Data Privacy Statement as provided in Annex no. 1.2 to the OTM-R POLICY - OPEN TRANSPARENT MERIT-BASED RECRUITMENT; 5
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person applying for employment at Lodz University of Technology, as provided in Annex no. 1.1 to the OTM-R POLICY - OPEN TRANSPARENT MERIT-BASED RECRUITMENT; 4) Data Privacy Statement as provided in
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under a work contract for a period of 48 months (duration of doctoral studies), Employment in a research organization focused on the implementation of innovative, prestigious R&D projects, 36 days
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years of experience in the R&D sector, including participation in research projects Experience in semiconductor structuring technologies (optical lithography, laser, electron beam or related) and/or