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Modeling and Simulation of Energy Storage Units interacting with the electric grid - 2026_CDR_DENG_1
storage system (understood as a whole, considering the cells, the BMS, the PCS, and the auxiliary systems), as well as their modeling in mathematical optimization tools and, finally, in dynamic simulation
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-21-CE08-007 ended in March 2025). The work in N POLAR will focus on the development and optimization of this innovative process (hybrid semiconductor/metal/semiconductor heterostructures) in order to
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robust biologically optimized Radiation Therapy to mitigate patient radiosensitivity uncertainty. 1) transfer of matRad code to a GPU computer for rapid simulation of biologically optimized treatment plans
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Inria, the French national research institute for the digital sciences | Paris 15, le de France | France | about 1 month ago
equipment, etc.) Social, cultural and sports events and activities Access to vocational training Social security coverage Selection process Website for additional job details https://jobs.inria.fr/public
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conduct in vivo experiments to investigate retinal neurovascular dynamics using the AO-RSO system; Develop or adapt high-speed image acquisition and processing methods for simultaneous measurement
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23 Dec 2025 Job Information Organisation/Company University of Siegen Research Field Computer science » Computer architecture Researcher Profile First Stage Researcher (R1) Positions PhD Positions
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and optimization of metasurfaces exhibiting tailored spectral responses at selected near-infrared wavelengths • Development of angularly robust optical functionalities over wide ranges of incidence
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team. Learn more about the innovative work led by Dr. Don Ingber here: https://wyss.harvard.edu/technology/erapid-multiplexed-electrochemical-sensors-for-fast-accurate-portable-diagnostics/. What you’ll
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optics experiments will contribute to a better understanding of local annealing processes, with the goal of achieving optimized control over the final material state, taking into account its crystalline
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research. Key Responsibilities: Develop and run a Cu–Cu hybrid bonding flow for fine-pitch 3D integration. Optimize process windows (pressure/temperature/anneal/surface activation) to minimize contact