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focuses on the development of new materials and processes for electronics packaging and bioelectronics applications. The research of the electronics packaging group in the Electronics Materials and Systems
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research questions. This postdoctoral scholarship offers the opportunity to be a part of this AI revolution by developing novel neural network architectures specifically optimized for plant genomic data. Our
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learning can improve software architecture recovery, how to optimize machine learning models at compile and runtime, and autonomous agents for software development. Part of the research is conducted through
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integrity in the design process calls for a technical model of the product concept, i.e., mathematical models of the product and its in-service environment, which inevitably must incorporate the influence