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microscopy, optical interferometry, vacuum technology, finite element method simulations will be involved. Applicants should hold a PhD in Physics, Nano-science, Engineering or similar, experience with optics
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Post-Doctoral Associate in Sand Hazards and Opportunities for Resilience, Energy, and Sustainability
-Lagrangian (CEL), Material Point Method (MPM), or advanced Finite Element Methods). Physical modeling of tunnel excavation and ground response (e.g., geotechnical centrifuge testing, lab-scale TBM experiments
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, or a closely related field with expertise in one or more of the following areas: Finite element methods for partial differential equations Multiscale numerical methods Flow and transport in porous
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modeling for neurobiology, including finite element modeling (FEM) or system identification methods in medical applications About the Department The Department of Biomedical Engineering is an academic unit
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working in radiological environment. Experience in heat transfer and thermal modeling/simulation using finite-element analysis (FEA) or other software. Ability to work within a multi-disciplinary team
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. The postdoctoral researcher will have the opportunity to: Study the principles of plant cell adhesion and tissue biomechanics. Use microscopy image processing tools and software. Use, refine and develop finite
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. Ability to perform finite element simulations using software such as COMSOL, ANSYS, or ABAQUS. Experience in utilizing these tools for in-depth analysis is highly desirable. Required License/Registration
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Postdoctoral Researcher position in AI and machine learning, with a focus on patient-specific reconstruction of coronary vessels and the simulation of stenting techniques using Finite Element Analysis (FEA) and
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, and high-performance computing. It aims to improve the performance of the matrix-free finite-element-based framework HyTeG, in particular by techniques for data reduction through surrogate operators
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., Multiphysics finite element analysis, Matlab, Labview etc.) cleanroom experience, and characterization of electronic devices are required. Further, knowledge of system level integration and haptics feedback in