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) department as Process Integration engineer. At the Technology Integration & Prototyping (TIP) department we have several Process Integration positions ranging from junior to senior level across several teams
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for: Test chip demonstrator definition, specifications, and planning. Physical design integration (including floorplanning) and signoff coordination at sub-system and full chip level. RTL design, IP selection
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(device, integration, analog design, test,...) You would be responsible for: Test chip demonstrator definition, specifications, and planning. Physical design integration (including floorplanning) and
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connectivity for next-generation AI, HPC, and Automotive applications. As a key member, you will architect demonstrators that emulate critical physical domains, electrical, thermal, and mechanical, while
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semiconductor industry. Utilizing the deep technical expertise of imec, engage in customer collaboration to setup established technology node processes at customer foundry sites, Process Integration and
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29 Sep 2025 Job Information Organisation/Company IMEC Research Field Engineering » Other Physics » Other Researcher Profile First Stage Researcher (R1) Recognised Researcher (R2) Established
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30 Sep 2025 Job Information Organisation/Company IMEC Research Field Engineering » Other Physics » Other Researcher Profile First Stage Researcher (R1) Recognised Researcher (R2) Established
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, thermal and power delivery to translate technology input into system-level methodologies and flows. Where to apply Website https://www.imec-int.com/en/work-at-imec/job-opportunities/digital-systems-rese
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with other experts from different fields to identify codesign solutions and to build the infrastructure required to evaluate them. This position plays a key role in our mission to shape the future
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is a driving force in most electronics applications. The continuous scaling of IC’s, and the advent of more compact system integration technologies make this possible. Within its affiliation programs