64 post-doc-image-processing Fellowship positions at Hong Kong Polytechnic University
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more than five years of post-qualification experience at the time of application. Preference will be given to those with related material processing and 3D printing research experience. Applicants are invited
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/TEA modeling, data analysis, and relevant software applications. For the post in Laser Flame Diagnostics, applicants should have relevant experimental background and data processing skills. For all
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Department of Industrial and Systems Engineering Postdoctoral Fellow / Research Associate / Research Assistant (Full-time/Part-time) (several posts) (Ref. 251203003) [Appointment period: each for
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Department of Building and Real Estate Postdoctoral Fellow / Research Associate / Research Assistant (two posts) (Ref. 251209010) [Appointment period: each for six to twelve months] Duties
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or his/her delegates. Qualifications Applicants for the Postdoctoral Fellow post should have a doctoral degree or an equivalent qualification and must have no more than five years of post-qualification
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experience at the time of application. For all posts, applicants should also have: (a) strong research background in speech deepfake detection, spoken language processing and/or speech recognition; (b
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and automation; (d) be proficient in designing and processing 3D-printers and sealed chambers; and (e) have strong problem-solving skills and a collaborative mindset. Post 2 of Research Assistant
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technology and equipment for micro/nanostructured device”. Qualifications For the post of Postdoctoral Fellow, applicants should have a doctoral degree or an equivalent qualification and must have no more than
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of the third-generation semiconductor substrates”. Qualifications For the post of Postdoctoral Fellow, applicants should have a doctoral degree or an equivalent qualification and must have no more than five
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-generation textile testing equipment using artificial skin”. Qualifications Applicants for the Postdoctoral Fellow post should have a doctoral degree in Thermal Engineering, Mechanical Engineering, Electronic